Job Title: Sr Principal Packaging EngineerLocation: San Jose, CAJob number: AI2344Job Description:Areas of focus and key responsibilities (include, but not limited to): Lead advanced FCBGA package development engineering activities, including co-design collaboration with Si and system module design teams to define package design rules, package attributes, BOM, and providing package options/proposals that are optimum to system integration with excellent cost, quality and field reliability for mass production. Major tasks include but not limit to:
Provide technical leadership in the package design, including layout, SI/PI, thermal and mechanical simulations to ensure electrical, thermal, and mechanical performance.
Collaborate with IP vendors and SiMa’s customer products system team to meet optimum system performance.
Ensure SIPI performance meets requirement for high-speed interfaces of complex mix-signal ICs.
Manage OSATs and external contractor teams to support design and NPI activities including characterization, qualification and productization at the right cost and quality for tier-1 customers, including Automotive.
Drive package production control, issues resolution, yield/DPPM monitoring and improvement, RMA and FA activities, working close with QA and Design teams.
Participate SiMa.ai customers’ engagements.
Required Background:
BSEE with 15+ or MSEE with 10+ experience, or related field of study
10+ years of experience in semiconductor packaging design, process & technology development, prefer to have worked in roles at both design house and OSAT’s.
Expert understanding and hands on experience of all aspects of complex high-speed mix-signal SoC High Performance FCBGA packaging development, focusing on high-speed interfaces: LPDDR5/5x, PCIe-5/6, ETH 10G+, etc.
Expert knowledge of advanced package design rules, including bumping and substrate design rules, with track records of handling trade-offs during development process.
Ability to drive package ball map definition for complex FCBGA packages, participating in IC floor planning definitions from early IC design stages and working close with IC physical design and system/module design teams for all product constraints
Deep understanding of detailed package SI/PI requirements and strong knowledge on fundamentals of SI/PI issues for high-speed interfaces with ability to define the setup and run SI/PI simulations, to correctly interpret analysis results and to provide recommendations for layout, BOM, and integration improvements
Handson experiences in proficiently using any of EDA tools such as HFSS, SI-Wave, APD+, Sigrity, ADS, PADs, and/or AutoDesk.
Excellent problem-solving skills in a dynamic and complex environment
Extensive experience collaborating with tier-1 OSAT vendors/suppliers
Experience with fcBGA failure mechanisms and failure analysis
Excellent verbal and written communication and presentation skills
Desired Qualifications and Skills:
Familiarity with WLFO, CoWoS, 2.5D and Chiplet technologies
Experience with Automotive products NPI to mass production
Experience with packaging aspects of advanced fab technology nodes (5nm and below)
Knowledge of APQP automotive development process
Knowledge of the thermal and mechanical analysis of the IC package development
The annual salary for this position ranges from $240,000 to $305,000. The actual annual salary paid for this position will be based on several factors, including but not limited to, skills, prior experiences, qualifications, expertise, work location, total target compensation, training, company needs, and current market demands. The annual salary range for this position is subject to change and may be adjusted in the future.Personal attributes:Excellent verbal communication; Critical thinking that focus on solutions not problems; Attention to details; Willing to learn; Empathy; Honest and respectful.EEO Employer: SiMa is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
